2003 Jul 28

21

Philips Semiconductors

Objective specification

2

× 120 W class-D power amplifier

TDA8924

16.11 Reference design: bill of materials

Table 1

Single-chip class-D audio amplifier printed-circuit board (version 4; 01-2002) for TDA8924TH

(see Figs 9 and 10)

Note

1. EP13 or 16RHBP inductors have been used in the first demo boards. In these boards, they functioned properly.

However current rating basically is too low. A better choice is the new TOKO DASM 998AM-105 inductor.

BOM

ITEM

QUANTITY

REFERENCE

PART

DESCRIPTION

1

1

U1

TDA8924TH

Philips Semiconductors B.V.

2

2

in1 and in2

cinch inputs

Farnell 152-396

3

2

out1 and out2

output connector

Augat 5KEV-02

41

supply connector

Augat 5KEV-03

5

2

L5 and L6

10

µH

EP13 or 16RHBP (TOKO);

note 1

6

4

L1, L2, L3 and L4

BEAD

Murata BL01RN1-A62

7

1

S1

PCB switch

Knitter ATE1E M-O-M

8

1

Z1

5V6

BZX 79C5V6 DO-35

9

2

C1 and C2

470

µF; 35 V

Panasonic M series

ECA1VM471

10

3

C3, C4 and C5

47

µF; 63 V

Panasonic NHG series

ECA1JHG470

11

6

C16, C17, C18 and C19

470 nF; 63 V

MKT EPCOS B32529- 0474- K

12

9

C8, C9, C11, C14, C28,

C29, C32, C35 and C38

220 nF; 63 V

SMD 1206

13

10

C6, C7, C10, C12, C13,

C15, C34, C36, C37 and

C39

100 nF; 50 V

SMD 0805

14

2

C20 and C21

330 pF; 50 V

SMD 0805

15

4

C22, C23, C30 and C31

15 nF; 50 V

SMD 0805

16

2

C24, C25

560 pF; 100 V

SMD 0805

17

1

C33

47 pF; 25V

SMD 0805

18

2

R3 and R4

39 k

Ω; 0.1 W

SMD 0805

19

1

R5

30 k

Ω; 0.1 W

SMD 1206

20

1

R1

10 k

Ω; 0.1 W; optional

SMD 0805

21

1

R2

9.1 k

Ω; 0.1 W; optional

SMD 0805

22

4

R6, R7, R8 and R9

5.6 k

Ω; 0.1 W

SMD 0805

23

2

R12 and R13

22

Ω; 1 W

SMD 2512

24

2

R10 and R11

4.7

Ω; 0.25 W

SMD 1206

25

2

C26 and C27

1

µF; 63V

MKT

26

1

heatsink

SK 174 50 mm (5 K/W) Fisher elektronik

27

1

printed-circuit board

material

1.6 mm thick epoxy FR4 material, dual-sided 35

µm copper;

clearances 300

µm; minimum copper track 400 µm