BUF12840

SBOS519A

– OCTOBER 2010 – REVISED JULY 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE

PRODUCT

PACKAGE

DESIGNATOR

PACKAGE MARKING

TRANSPORT MEDIA, QUANTITY

BUF12840

VQFN-24

RGE

BUF12840

Tape and Reel, 3000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

PARAMETER

BUF12840

UNIT

Supply Voltage

+22

V

Supply Voltage

+6

V

Supply Input Terminals, SCL, SDA, A0, BKSEL, EA0, EA1, EN, LD: Voltage

–0.5 to +6

V

Supply Input Terminals, SCL, SDA, A0, BKSEL, EA0, EA1, EN, LD: Current

±10

mA

Continuous

Operating Temperature

–40 to +95

°C

Storage Temperature

–65 to +150

°C

Junction Temperature

+125

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Short-circuit to ground. Exposed thermal die is soldered to the PCB using thermal vias. Refer to Texas Instruments application report

QFN/SON PCB Attachment (SLUS271).

THERMAL INFORMATION

BUF12840

RGE

UNITS

24 PINS

Junction-to-ambient thermal resistance

35.6

Junction-to-case(top) thermal resistance

40.5

Junction-to-board thermal resistance

10.0

°C/W

Junction-to-top characterization parameter

0.5

Junction-to-board characterization parameter

9.9

Junction-to-case(bottom) thermal resistance

3.0

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Copyright

© 2010–2011, Texas Instruments Incorporated