IX4426-27-28

12

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R05

5.4 Mechanical Dimensions

5.4.1 “N” Package (8-Pin SOIC)

5.4.2 “N” Package Tape & Reel

NOTES:

1. Complies with JEDEC Standard MS-012.

2. All dimensions are in millimeters.

3. Dimensions do not include mold flash or burrs

PCB Land Pattern

Pin 1

Pin 8

3.90 ± 0.10

6.00 ± 0.20

0.42 ± 0.09

4.90 ± 0.10

1.27 REF

1.25 min

0.175 ± 0.075

0.40 min

1.27 max

1.27

5.60

1.75

0.65

1.75 max

Dimensions

mm

(inches)

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

K

(0.083)

W=12.00

(0.472)

B

(0.209)

User Direction of Feed

A

(0.256)

P=8.00

(0.315)