5

SN54HC32, SN74HC32

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SCLS200E – DECEMBER 1982 – REVISED JULY 2016

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Copyright © 1982–2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: SN54HC32

SN54HC32

UNIT

CDIP (J)

CFP (W)

LCCC (FK)

14 PINS

14 PINS

20 PINS

Junction-to-ambient thermal resistance

—

—

—

°C/W

Junction-to-case (top) thermal resistance

54.9

88.3

61

°C/W

Junction-to-board thermal resistance

80.1

156

59.6

°C/W

Junction-to-top characterization parameter

—

—

—

°C/W

Junction-to-board characterization parameter

—

—

—

°C/W

Junction-to-case (bottom) thermal resistance

25.1

15.2

11.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: SN74HC32

SN74HC32

UNIT

SOIC (D)

SSOP (DB)

PDIP (N)

SOP (NS)

TSSOP (PW)

14 PINS

14 PINS

14 PINS

14 PINS

14 PINS

Junction-to-ambient

thermal resistance

90.1

105.4

54.9

88.8

119.6

°C/W

Junction-to-case (top)

thermal resistance

50.3

57.3

42.5

46.5

48.4

°C/W

Junction-to-board

thermal resistance

44.4

52.7

34.7

47.6

61.3

°C/W

Junction-to-top

characterization parameter

17.9

22.6

27.9

16.8

5.6

°C/W

Junction-to-board

characterization parameter

44.1

52.2

34.6

47.2

60.7

°C/W

Junction-to-case (bottom)

thermal resistance

—

—

—

—

—

°C/W

6.6

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

1.9

1.998

V

4.4

4.499

5.9

5.999

3.98

4.3

SN54HC32

3.7

SN74HC32

3.84

5.48

5.8

SN54HC32

5.2

SN74HC32

5.34