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PACKAGE OUTLINE

C

4X 0.27

0.17

3X 0.32

0.23

0.4 MAX

0.05

0.00

2X

0.48

0.27

0.17

0.25 0.1

B

0.85

0.75

A

0.85

0.75

(0.1)

(0.06)

X2SON - 0.4 mm max height

DPW0005A-C01

PLASTIC SMALL OUTLINE - NO LEAD

4221849/A 12/2014

PIN 1 INDEX AREA

SEATING PLANE

NOTE 4

1

2

3

4

0.1 C A

B

0.05 C

THERMAL PAD

5

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

4. The size and shape of this feature may vary.

SN74LVC1GXX and SN74AUP1GXX

SN74LVC1GXX and SN74AUP1GXX

NOTE 4

SCALE 12.000