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PCM2702E/2K Datasheet(PDF) 2 Page - Texas Instruments |
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PCM2702E/2K Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 17 page ![]() PCM2702 2 SBAS142A www.ti.com Supply Voltage(2) .............................................................................................................. +6.5V Supply Voltage(3) .............................................................................................................. +4.0V Supply Voltage Differences(4) .................................................................................. ±0.1V Supply Voltage Differences(5) .................................................................................. ±0.1V Ground Voltage Differences(6) ................................................................................. ±0.1V Digital Input Voltage(7) ................................................................. –0.3V to VDD + 0.3V Digital Input Voltage(8) ................................................................................ –0.3V to 6.5V Analog Input Voltage ................................................ –0.3V to VCC + 0.3V Input Current (any pins except supplies) ....................................... ±10mA Operating Temperature .................................................. –25 °C to +85°C Storage Temperature ..................................................... –55 °C to +125°C Junction Temperature .................................................................... +150 °C Lead Temperature (soldering, 5s) ................................................. +260 °C Package Temperature (IR reflow, peak, 10s) ............................... +235 °C NOTES: (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. (2) VCC, VCCL, VCCR, VDDP. (3) VDD, VDDC. (4) Among VCC, VCCL, VCCR, VCCP. (5) Among VDD, VDDC. (6) Among AGND, AGNDL, AGNDR, AGNDP, DGND, DGNDC, and DGNDU. (7) XTI, D+, D–, PLYBCK, SSPND, ZERO, XTO. (8) VBUS, TEST#, TEST2, TEST1, TEST0. ABSOLUTE MAXIMUM RATINGS(1) PIN NAME TYPE DESCRIPTIONS 1 XTI IN Crystal Oscillator Input.(1) 2VDDC — Digital Power Supply for Clock Generator, +3.3V. 3 DGNDC — Digital Ground for Clock Generator. 4VDD — Digital Power Supply, +3.3V. 5 DGND — Digital Ground. 6 D+ IN/OUT USB Differential Input/Output Plus. 7 D– IN/OUT USB Differential Input/Output Minus. 8VBUS IN USB Bus Power (this pin NEVER consumes USB bus power).(2) 9 DGNDU — Digital Ground for USB Transceiver. 10 PLYBCK OUT Playback flag, active LOW (LOW: playback, HIGH: idle). 11 SSPND OUT Suspend flag, active LOW (LOW: suspend, HIGH: operational). 12 ZERO OUT Zero flag (LOW: Normal, HIGH: ZERO.) 13 TEST3 IN Test pin 3. Connect to digital ground.(2) 14 TEST2 IN Test pin 2. Connect to digital ground.(2) 15 TEST1 IN Test pin 1. Connect to digital ground.(2) 16 TEST0 IN Test pin 0. Connect to digital ground.(2) 17 VCCR — Analog Supply for R-channel, +5V. 18 AGNDR — Analog Ground for R-channel. 19 VOUTR OUT Analog Output for R-channel. 20 AGND — Analog Ground. 21 VCOM — DC Common-Mode Voltage for DAC. 22 VCC — Analog Supply, +5V. 23 VOUTL OUT Analog Output for L-channel. 24 AGNDL — Analog Ground for L-channel. 25 VCCL — Analog Supply for L-channel, +5V. 26 AGNDP — Analog Ground for PLL. 27 VCCP — Analog Supply for PLL, +5V. 28 XTO OUT Crystal Oscillator Output. NOTES: (1) 3.3 V tolerant. (2) Schmitt trigger input with internal pull-down, 5V tolerant. XTI V DDC DGNDC V DD DGND D+ D– V BUS DGNDU PLYBCK SSPND ZERO TEST3 TEST2 XTO V CCP AGNDP V CCL AGNDL V OUTL V CC V COM AGND V OUTR AGNDR V CCR TEST0 TEST1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 PCM2702 Top View SSOP ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper han- dling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA PCM2702E SSOP-28 DB 0 °C to +70°C PCM2702E PCM2702E Rails "" " " " PCM2702E/2K Tape and Reel |
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