LMH6739 datasheet(2/19 Pages) TI1

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LMH6739

SNOSAD2G – MAY 2004 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

ESD Tolerance (2)

Human Body Model

2000V

Machine Model

200V

Supply Voltage (V+ - V–)

13.2V

IOUT

(3)

Common Mode Input Voltage

±VCC

Maximum Junction Temperature

+150°C

Storage Temperature Range

−65°C to +150°C

Soldering Information

Infrared or Convection (20 sec.)

235°C

Wave Soldering (10 sec.)

260°C

Storage Temperature Range

−65°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical

Characteristics tables.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(3)

The maximum output current (IOUT) is determined by device power dissipation limitations. See the Power Dissipation section of the

Application Information for more details.

Operating Ratings

(1) (2)

Temperature Range (3)

−40°C to +85°C

Supply Voltage (V+ - V–)

8V to 12V

Thermal Resistance

Package

(

θJC)

(

θJA)

16-Pin SSOP

36°C/W

120°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical

Characteristics tables.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(3)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

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