LMH6682MASLASHNOPB datasheet(2/31 Pages) TI1

2 / 31 page

LMH6682, LMH6683

SNOSA43A – MAY 2004 – REVISED APRIL 2013

www.ti.com

Connection Diagram

Figure 1. SOIC-8/VSSOP-8 (LMH6682)

Figure 2. SOIC-14/TSSOP-14 (LMH6683)

Top View

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

ESD Tolerance

Human Body Model

2KV(3)

Machine Model

200V(4)

VIN Differential

±2.5V

Output Short Circuit Duration

See(5)(6)

Input Current

±10mA

Supply Voltage (V+ - V−)

12.6V

Voltage at Input/Output pins

V+ +0.8V, V−

−0.8V

Soldering Information

Infrared or Convection (20 sec.)

235°C

Wave Soldering (10 sec.)

260°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature(7)

+150°C

(1)

Absolute maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Human body model, 1.5k

Ω in series with 100pF.

(4)

Machine Model, 0

Ω in series with 200pF.

(5)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(6)

Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms.

(7)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

Operating Ratings

(1)

Supply Voltage (V+ – V−)

3V to 12V

Operating Temperature Range(2)

−40°C to +85°C

Package Thermal Resistance(2)

SOIC-8

190°C/W

VSSOP-8

235°C/W

SOIC-14

145°C/W

TSSOP-14

155°C/W

(1)

Absolute maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

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