THS6052, THS6053

175 mA, ±12 V ADSL CPE LINE DRIVERS

SLOS293D − JUNE 2000 − REVISED DECEMBER 2001

2

POST OFFICE BOX 655303

AVAILABLE OPTION

PACKAGED DEVICE

EVALUATION

TA

SOIC-8

(D)

SOIC-8 PowerPAD

(DDA)

SOIC-14

(D)

TSSOP-14

(PWP)

EVALUATION

MODULES

0

°C to 70°C

THS6052CD

THS6052CDDA

THS6053CD

THS6053CPWP

THS6052EVM

THS6053EVM

−40

°C to 85°C

THS6052ID

THS6052IDDA

THS6053ID

THS6053IPWP

—

33 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output current (see Note 1)

275 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Differential input voltage

± 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum junction temperature

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Total power dissipation at (or below) 25

°C free-air temperature

See Dissipation Ratings Table

. . . . . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Industrial

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Industrial

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The THS6052 and THS6053 may incorporate a PowerPAD

 on the underside of the chip. This acts as a heatsink and must be

connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI technical brief SLMA002 for more information about utilizing the

PowerPAD

DISSIPATION RATING TABLE

PACKAGE

θJA

θJC

TA = 25°C

TJ = 150°C

POWER RATING

D-8

95

°C/W‡

38.3

°C/W‡

1.32 W

DDA

45.8

°C/W‡

9.2

°C/W‡

2.73 W

D-14

66.6

°C/W‡

26.9

°C/W‡

1.88 W

PWP

37.5

°C/W

1.4

°C/W

3.3 W

‡ This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test

PCB, the

ΘJA is168°C/W for the D−8 package and 122.3°C/W for the D−14 package.

recommended operating conditions

MIN

NOM

MAX

UNIT

Supply voltage, VCC+ to VCC−

Dual supply

±5

±15

V

Supply voltage, VCC+ to VCC−

Single supply

10

30

V

Operating free-air temperature, TA

C-suffix

0

70

°C

Operating free-air temperature, TA

I-suffix

−40

85

°C