All Rights Reserved. No part of this document may be copied or reproduced in any form without the prior written permission of Micrel, Inc. Micrel Inc. may update or make changes

to the contents, products, programs or services described at any time without notice. This document neither states nor implies any kind of warranty, including, but not limited to

implied warranties of merchantability or fitness for a particular use.

Page 5

MK-Q-B-P-D-031809-05-7

DSC1018

1.8V

Low-Power CMOS Oscillator

Board Layout (recommended)

Solder Reflow Profile

Package Dimensions

7.0 x 5.0 mm Plastic Package

MSL 1 @ 260°C refer to JSTD-020C

Ramp-Up Rate (200°C to Peak Temp)

3°C/Sec Max.

Preheat Time 150°C to 200°C

60-180 Sec

Time maintained above 217°C

60-150 Sec

Peak Temperature

255-260°C

Time within 5°C of actual Peak

20-40 Sec

Ramp-Down Rate

6°C/Sec Max.

Time 25°C to Peak Temperature

8 min Max.

Pin Terminal

VDD

Standby#

Output

GND

#1

#2

#3

#4

7.0±0.10 [0.276±0.004]

5.0±0.10 [0.197±0.004]

External Dimensions

#4

#3

5.08 [0.2]

#2

#1

1.2 [0.047]

1.4 [0.055]

0.85±0.05 [0.033±0.002]

Recommended Land Pattern*

1.4 [0.055]

1.4 [0.055]

5.08 [0.200]

units: mm [inch]

No.

4

1

3

2

0.2 [0.008]

2.6 [0.102]

2.6 [0.102]

0.2 [0.008]

2.2 [0.087]

3.5 [0.138]

o o

o o

o o

0.2 [0.008]

*Note: The center pad is not connected

internally and should be left un-

connected or tied to GND.

60-150

Sec

20-40

Sec

60-180

Sec

8 min max

Pre heat

Reflow

Cool

Time

200°C

217°C

150°C

25°C

260°C

60-150

Sec

20-40

Sec

60-180

Sec

8 min max

Pre heat

Reflow

Cool

Time

200°C

217°C

150°C

25°C

260°C

60-150

Sec

20-40

Sec

60-180

Sec

8 min max

Pre heat

Reflow

Cool

Time

200°C

217°C

150°C

25°C

260°C