30

80

130

180

0

0.5

1.5

COPPER AREA (sq. in.)

1

LP3881

www.ti.com

SNVS224F – MARCH 2003 – REVISED APRIL 2013

Figure 21. Maximum power dissipation vs ambient temperature for TO-263 package

HEATSINKING SOIC PACKAGE

Heatsinking for the SOIC-8 package is accomplished by allowing heat to flow through the ground slug on the

bottom of the package into the copper on the PC board. The heat slug must be soldered down to a copper plane

to get good heat transfer. It can also be connected through vias to internal copper planes. Since the heat slug is

at ground potential, traces must not be routed under it which are not at ground potential. Under all possible

conditions, the junction temperature must be within the range specified under operating conditions.

Figure 22 shows a curve for the

one ounce copper in still air.

Figure 22.

Copyright © 2003–2013, Texas Instruments Incorporated

Submit Documentation Feedback

11

Product Folder Links: LP3881