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TLC545IN Datasheet(PDF) 13 Page - Texas Instruments |
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TLC545IN Datasheet(HTML) 13 Page - Texas Instruments |
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13 / 15 page  PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples TLC545CFN NRND PLCC FN 28 37 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC545CFN TLC545CN OBSOLETE PDIP N 28 TBD Call TI Call TI TLC545CN TLC545CNG4 OBSOLETE PDIP N 28 TBD Call TI Call TI TLC545IFN NRND PLCC FN 28 37 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC545IFN TLC545IFNR OBSOLETE PLCC FN 28 TBD Call TI Call TI TLC545IN OBSOLETE PDIP N 28 TBD Call TI Call TI TLC545IN TLC545ING4 OBSOLETE PDIP N 28 TBD Call TI Call TI TLC546IFN OBSOLETE PLCC FN 28 TBD Call TI Call TI TLC546IFNR OBSOLETE PLCC FN 28 TBD Call TI Call TI TLC546IN OBSOLETE PDIP N 28 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. |
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