LP3984 datasheet(3/19 Pages) TI1

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LP3984

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SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

VIN, VEN

−0.3 to 6.5V

VOUT

–0.3 to (VIN+0.3) ≤ 6.5V

Junction Temperature

150°C

Storage Temperature

−65°C to +150°C

Lead Temp.

235°C

Pad Temp.(4)

235°C

Maximum Power Dissipation(5)

SOT-23-5

364 mW

DSBGA

235 mW

ESD Rating(6)

Human Body Model

2kV

Machine Model

200V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Additional information on pad temperature can be found in the TI AN-1112 Application Report ().

(5)

The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula: PD = (TJ -

TA)/θJA,where TJ is the junction temperature, TA is the ambient temperature, and θ JA is the junction-to-ambient thermal resistance. The

364 mW rating for SOT23-5 appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction

temperature, 150°C, for TJ, 70°C for TA, and 220°C/W for θJA. More power can be dissipated safely at ambient temperatures below

70°C . Less power can be dissipated safely at ambient temperatures above 70°C. The Absolute Maximum power dissipation for SOT23-

5 can be increased by 4.5 mW for each degree below 70°C, and it must be derated by 4.5mW for each degree above 70°C.

(6)

The human body model is 100pF discharged through 1.5k

Ω resistor into each pin. The machine model is a 200 pF capacitor discharged

directly into each pin.

OPERATING RATINGS

(1) (2)

VIN

2.5 to 6V

VEN

0 to (VIN+0.3V) ≤ 6V

Junction Temperature

−40°C to +125°C

Thermal Resistance

θJA (SOT23-5)

220°C/W

θJA (DSBGA)

340°C/W

Maximum Power Dissipation(3)

SOT-23-5

250mW

DSBGA

160mW

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The

250mW rating for SOT23-5 appearing under Operating Ratings results from substituting the maximum junction temperature for

operation, 125°C, for TJ, 70°C for TA, and 220°C/W for θJA using the formula: PD = (TJ - TA)/θJA. More power can be dissipated at

ambient temperatures below 70°C . Less power can be dissipated at ambient temperatures above 70°C. The maximum power

dissipation for operation can be increased by 4.5 mW for each degree below 70°C, and it must be derated by 4.5mW for each degree

above 70°C.

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