TLK2701IRCPR datasheet(11/27 Pages) TI1

11 / 27 page

TLK2701

1.6 TO 2.7 GBPS TRANSCEIVER

SLLS429D − AUGUST 2000 − REVISED MARCH 2008

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†

Supply voltage, VDD (see Note 1)

−0.3 to 3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage range at TXD, ENABLE, GTX_CLK, TKLMSB, TKLLSB, LOOPEN, PRBS_PASS

−0.3 to 4 V

. . . . . . . .

Voltage range at any other terminal except above

−0.3 to VDD+0.3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package power dissipation, PD

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature, Tstg

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrostatic discharge

HBM:2 kV, CDM:1 kV

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Characterized free-air operating temperature range, TA

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25_C

POWER RATING

DERATING FACTOR‡

ABOVE TA = 25_C

TA = 70_C

POWER RATING

RCP64§

5.25 W

46.58 mW/

2.89 W

RCP64¶

3.17 W

23.70 mW/

1.74 W

RCP64#

2.01 W

13.19 mW/

1.11 W

‡ This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).

§ 2 oz. Trace and copper pad with solder.

¶ 2 oz. Trace and copper pad without solder.

# Standard JEDEC High-K board.

For more information, refer to TI application note PowerPAD Thermally Enhanced Package, TI literature number

SLMA002.

electrical characteristics over recommended operating conditions

PARAMETER

TEST CONDITIONS

MIN

NOM

MAX

UNIT

Supply voltage, VDD

2.3

2.5

2.7

Frequency = 1.6 Gbps, PRBS pattern

105

Supply current, ICC

Frequency = 2.7 Gbps, PRBS pattern

156

Frequency = 1.6 Gbps, PRBS pattern

262

Power dissipation, PD

Frequency = 2.7 Gbps, PRBS pattern

390

Power dissipation, PD

Frequency = 2.7 Gbps, worst case pattern||

500

Shutdown current

Enable = 0, VDDA, VDD terminals, VDD = MAX

PLL startup lock time

VDD,VDDC = 2.3V

0.1

0.4

Operating free-air temperature, TA

− 40

°C

|| Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.

reference clock (GTX_CLK) timing requirements over recommended operating conditions (unless

otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Frequency

Minimum data rate

Typ −0.01%

Typ+0.01%

MHz

Frequency

Maximum data rate

Typ −0.01%

135

Typ+0.01%

MHz

Frequency tolerance

− 100

100

ppm

Duty cycle

40%

50%

60%

Jitter

Peak-to-peak

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