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UCC2918DP Datasheet(PDF) 1 Page - Texas Instruments |
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UCC2918DP Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 10 page ![]() UCC2918/81510 LOW ONRESISTANCE HOT SWAP POWER MANAGER SLUS457C − JULY 2000 - REVISED APRIL 2001 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Integrated 0.075-Ω Power MOSFET D 3 V to 6 V Operation D External Analog Control of Fault Current From 0 A to 4 A D Independent Analog Control of Current Limit up to 5 A D Fast Overload Protection D Unidirectional Switch D Minimal External Components D 1-µA ICC When Disabled D Programmable On Time D Programmable Start Delay D Fixed 3% Duty Cycle description The UCC2918 low on-resistance hot swap power manager provides complete power management, hot swap capability, and circuit breaker functions. The only components needed to operate the device, other than supply bypassing, are a timing capacitor and two programming resistors. All control and housekeeping functions are integrated and externally programmable. These include the fault current level, maximum output sourcing current, maximum fault time, and startup delay. In the event of a constant fault, the internal fixed 3% duty cycle ratio limits the average output power. The IFAULT pin allows linear programming of the fault level current from 0 A to 4 A. functional block diagram 9 8 5 4 13 12 10 6 7 3 2 1 INTERNAL BIAS THERMAL SHUTDOWN ON TIME CONTROL 3% DUTY CYCLE CHARGE PUMP 16 15 14 VIN VIN VIN VOUT VOUT VOUT SHTDWN FAULT CT HEAT SINK GND PINS GND IFAULT IMAX CURRENT FAULT LEVEL OVERLOAD COMPARATOR OVERCURRENT COMPARATOR REVERSE COMPARATOR VOUT + 20mV CURRENT SENSE 1.5V H = OPEN MAXIMUM CURRENT LEVEL + + + + + + UDG−00101 Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Pin 5 serves as the lowest impedance to the electrical ground. Pins 4, 12, and 13, serve as heat sink/ground. These pins should be connected to large etch PCB areas to help dissipate heat. 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VIN VIN VIN GND* GND* FAULT SHTDWN IFAULT VOUT VOUT VOUT GND* GND* NC CT IMAX DP PACKAGE (TOP VIEW) |
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