2

UCC5622

Other features include thermal shutdown and current

limit. This device is offered in low thermal resistance ver-

sions of the industry standard 44 pin wide body QSOP

(MWP). Consult QSOP-44 Packaging Diagram for exact

dimensions.

DESCRIPTION (cont.)

L9

L8

L23

L24

1

2

3

4

N/C

N/C

L25

L26

5

6

7

8

GND

L27

GND

GND

9

10

11

12

DISCNCT1

GND

DISCNCT2

L10

13

14

15

16

L12

L11

L13

L14

17

18

19

20

L2

L1 21

22

L8

L7

L5

L22

44

43

42

41

L21

N/C

L20

L19

40

39

38

37

GND

REG

GND

GND

36

35

34

33

TRMPWR

GND

L18

L17

32

31

30

29

N/C

L16

N/C

L15

28

27

26

25

L3

L4

24

23

CONNECTION DIAGRAM

QSOP-44 (Top View)

MWP Package

ABSOLUTE MAXIMUM RATINGS

TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V

Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V

Regulator Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A

Storage Temperature . . . . . . . . . . . . . . . . . . . 65 C to +150 C

Junction Temperature . . . . . . . . . . . . . . . . . . . 55 C to +150 C

Lead Temperature (Soldering, 10 Sec.). . . . . . . . . . . . . +300 C

Currents are positive into, negative out of the specified termi-

nal. Consult Packaging Section of Databook for thermal limita-

tions and considerations of packages.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Supply Current Section

TRMPWR Supply Current

All Termination Lines = Open

1

2

mA

All Termination Lines = 0.2V

630

650

mA

Power Down Mode

DISCNCT1 = DSCNCT2 = TRMPWR

100

200

A

Output Section (Termination Lines)

Termination Impedance

(Note 3)

104.5

110

115.5

Output High Voltage

(Note 1)

2.6

2.8

3.0

V

Max Output Current

22.1

23.3

24

mA

20.7

23.3

24

mA

21

23

24

mA

20

23

24

mA

22.4

mA

Output Leakage

DISCNCT1 = DISCNCT2 = 2.4V, TRMPWR = 0V to

5.25V

10

400

nA

Output Capacitance

DISCNCT1 = DISCNCT2 = 2.4V (Note 2)

2.5

4

pF