MCP2050T-ESLASHP datasheet(18/40 Pages) MICROCHIP

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MCP2050

DS20002299C-page 18

 2012-2014 Microchip Technology Inc.

2.0

ELECTRICAL

CHARACTERISTICS

2.1

Absolute Maximum Ratings†

VIN DC Voltage on RXD, and RESET ................................................................................................ -0.3V to VREG + 0.3

VIN DC Voltage on TXD, CS/LWAKE, FAULT/TXE......................................................................................... -0.3 to + 40V

VBB Battery Voltage, continuous, non-operating (Note 1)............................................................................ -0.3 to + 40V

VBB Battery Voltage, non-operating (LIN bus recessive, no regulator load, t < 60s) (Note 2) ..................... -0.3 to + 43V

VBB Battery Voltage, transient ISO 7637 Test 1 ..................................................................................................... -100V

VBB Battery Voltage, transient ISO 7637 Test 2a .....................................................................................................+75V

VBB Battery Voltage, transient ISO 7637 Test 3a ................................................................................................... -150V

VBB Battery Voltage, transient ISO 7637 Test 3b ...................................................................................................+100V

VLBUS Bus Voltage, continuous..................................................................................................................... -18 to + 30V

VLBUS Bus Voltage, transient (Note 3) .......................................................................................................... -27 to + 43V

ILBUS Bus Short-Circuit Current Limit ....................................................................................................................200 mA

ESD protection on LIN, VBB (IEC 61000-4-2) (Note 4) ......................................................................................... ±15 KV

ESD protection on LIN, VBB (Human Body Model) (Note 5)................................................................................... ±8 KV

ESD protection on all other pins (Human Body Model) (Note 5) ............................................................................ ±4 KV

ESD protection on all pins (Charge Device Model) (Note 6).................................................................................±1500V

ESD protection on all pins (Machine Model) (Note 7).............................................................................................±200V

Maximum Junction Temperature ............................................................................................................................. 150

C

Storage Temperature..................................................................................................................................-65 to + 150

C

Note 1:

LIN 2.x compliant specification.

SAE J2602-2 compliant specification.

ISO 7637/1 load dump compliant (t < 500 ms).

According to IEC 61000-4-2, 330 ohm, 150 pF and Tranceiver EMC Test Specifications [2] to [4]

According to AEC-Q100-002/JESD22-A114

According to AEC-Q100-011B

According to AEC-Q100-003/JESD22-A115

2.2

Nomenclature used in this document

Some terms and names used in this data sheet deviate from those referred to in the LIN specifications. Equivalent

values are shown below.

† NOTICE

: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This

is a stress rating only and functional operation of the device at those or any other conditions above those indicated in

the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods

may affect device reliability.

LIN 2.1 Name

Term used in the following tables

Definition

VBAT

not used

ECU operating voltage

VSUP

VBB

Supply voltage at device pin

VBUS_LIM

ISC

Current Limit of Driver

VBUSREC

VIH(LBUS)

Recessive state

VBUSDOM

VIL(LBUS)

Dominant state

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