MCP111 datasheet(27/32 Pages) MICROCHIP

27 / 32 page

 2004-2016 Microchip Technology Inc.

DS20001889F-page 27

MCP111/112

APPENDIX A:

REVISION HISTORY

Revision F (July 2016)

The following is the list of modifications:

Updated Table 3-1.

Updated Section 5.0 “Packaging informa-

tion”.

Minor typographical corrections.

Revision E (January 2013)

• Added a note to each package outline drawing.

Revision D (June 2005)

Added

SOT-89-3

package

information

throughout.

Revision C (March 2005)

The following is the list of modifications:

Added Section 4.4 “Using in PIC® Microcon-

troller ICSP™ Applications (MCP111 only)”

on using the MCP111 in PIC microcontroller

ICSP applications.

Added VODH specifications in Section 1.0

“Electrical

Characteristics”

(for

ICSP

applications).

Added Figure 2-28.

Added devices features table to page 1.

Updated SC-70 package markings and added

Pb-free marking information to Section 5.0

“Packaging information”.

Added Appendix A: “Revision History”.

Revision B (August 2004)

Corrected package marking information in

Section 5.0 “Packaging information”.

Revision A (May 2004)

• Original release of this document.

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