 2004-2016 Microchip Technology Inc.

DS20001889F-page 19

MCP111/112

Microchip Technology Drawing C04-060C Sheet 2 of 2

Number of Pins

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E1

A2

e

L

E

N

0.65 BSC

0.10

0.15

0.80

0.00

-

0.20

1.25 BSC

-

-

2.10 BSC

MILLIMETERS

MIN

NOM

3

0.46

0.40

1.10

0.10

MAX

c

-

0.20

0.26

Lead Thickness

3-Lead Plastic Small Outline Transistor (LB) [SC70]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Overall Length

Exposed Pad Length

D

D2

2.50

2.00 BSC

2.60

2.70

0.80

-

1.00

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

protrusions shall not exceed 0.15mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M