OPA2691

2

SBOS224D

www.ti.com

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPA2691

SO-8

D

–40

°C to +85°C

OPA2691

OPA2691ID

Rails, 100

"

"""

"

OPA2691IDR

Tape and Reel, 2500

OPA2691

SO-14

D

–40

°C to +85°C

OPA2691

OPA2691I-14D

Rails, 58

"

"""

"

OPA2691I-14DR

Tape and Reel, 2500

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at

www.ti.com.

1

2

3

4

5

6

7

NC = No Connection

14

13

12

11

10

9

8

–In A

+In A

DIS A

–V

S

DIS B

+In B

–In B

Out A

NC

NC

+V

S

NC

NC

Out B

Power Supply ...............................................................................

±6.5V

DC

Differential Input Voltage ..................................................................

±1.2V

Input Voltage Range ...........................................................................

±V

S

Storage Temperature Range: D, 14D ............................ –65

°C to +125°C

Lead Temperature (soldering, 10s) .............................................. +300

°C

ESD Performance:

HBM .............................................................................................. 2000V

CDM .............................................................................................. 1500V

NOTES:: (1) Stresses above those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability. (2) Packages

must be derated based on specified

θ

PIN CONFIGURATIONS

Top View

SO-8

SO-14

1

2

3

4

8

7

6

5

+V

S

Out B

–In B

+In B

Out A

–In A

+In A

–V

S

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.