Batch process design, excellent power dissipation offers

better reverse leakage current and thermal resistance.

Wide zener reverse voltage range 6.2V to 100V.

Small package size for high density applications.

Ideally suited for automated assembly processes.

Lead-free parts meet environmental standards of

MIL-STD-19500 /228

Features

Suffix "-H" indicates Halogen-free part, ex.ZGFM5341B-H.

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Package outline

Page 2

5.0W Surface Mount

Zener Diodes-6.2V-100V

PARAMETER

Symbol

P

D

MIN.

TYP.

MAX.

5.0

UNIT

W

Storage temperature range

Operating junction temperature range

T

STG

T

J

-55

-65

+150

+175

A

o

Power Dissipation at T = 75 C

L

°

Formosa MS

Chip Zener Diode

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Mechanical data

Epoxy:UL94-V0 rated flame retardant

Case : Molded plastic,

Terminals : Solder plated, solderable per

MIL-STD-750, Method 2026

Polarity : Indicated by cathode band

Mounting Position : Any

Weight : Approximated 0.19 gram

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DO-214AB / SMC

0.272(6.9)

0.248(6.3)

0.012(0.3) Typ.

0.189(4.8)

0.165(4.2)

0.098(2.5)

0.075(1.9)

0.048 (1.2) Typ.

0.048(1.2) Typ.

Dimensions in inches and (millimeters)

SMC

Document ID

Issued Date

Revised Date

Revision

Page.

Thermal Characteristics

°C/W

Typical thermal resistance junction to lead

R

θJL

23

PARAMETER

Symbol

UNIT

Limit

°C/W

Typical thermal resistance junction to ambient

R

θJA

50

Note

1 Mounted on FR-4 PCB

：.

ZGFM5341B THRU ZGFM5378B

V

F

1.20

V

Forward voltage at I = 1.0A

F

DS-121743

2009/08/10

2014/02/26

E

8