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DS90C383 Datasheet(PDF) 1 Page - National Semiconductor (TI) |
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DS90C383 Datasheet(HTML) 1 Page - National Semiconductor (TI) |
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1 / 20 page ![]() DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link—65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link—65 MHz General Description The DS90C383 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS (Low Voltage Differential Signal- ing) data streams. A phase-locked transmit clock is transmit- ted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver con- verts the LVDS data streams back into 28 bits of LVCMOS/ LVTTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is of- fered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmit- ter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge trans- mitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. Both devices are also offered in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package which provides a 44 % reduction in PCB footprint compared to the TSSOP package. This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces. Features n 20 to 65 MHz shift clock support n Programmable transmitter (DS90C383) strobe select (Rising or Falling edge strobe) n Single 3.3V supply n Chipset (Tx + Rx) power consumption < 250 mW (typ) n Power-down mode (< 0.5 mW total) n Single pixel per clock XGA (1024x768) ready n Supports VGA, SVGA, XGA and higher addressability. n Up to 227 Megabytes/sec bandwidth n Up to 1.8 Gbps throughput n Narrow bus reduces cable size and cost n 290 mV swing LVDS devices for low EMI n PLL requires no external components n Low profile 56-lead TSSOP package. n Also available in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package n Falling edge data strobe Receiver n Compatible with TIA/EIA-644 LVDS standard n ESD rating >7kV n Operating Temperature: −40˚C to +85˚C Block Diagrams TRI-STATE® is a registered trademark of National Semiconductor Corporation. Typical Application DS012887-2 November 2000 © 2000 National Semiconductor Corporation DS012887 www.national.com |
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