IPS521G

2

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(1) Limited by junction temperature (pulsed current limited also by internal wiring)

Symbol Parameter

Min.

Typ.

Max. Units Test Conditions

Rth1

Thermal resistance with standard footprint

—



a

Rth2

Thermal resistance with 1" square footprint

—

&

a

Thermal Characteristics

8 Lead SOIC

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters

are referenced to GROUND lead. (Tj = 25

Symbol Parameter

Min.

Max.

Units

Test Conditions

Vout

Maximum output voltage

Vcc-50 Vcc+0.3

Voffset

Maximum logic ground to load ground offset Vcc-50 Vcc+0.3

Vin

Maximum Input voltage

-0.3

5.5

Iin, max

Maximum positive IN current

-5

10

mA

Vdg

Maximum diagnostic output voltage

-0.3

5.5

V

Idg, max

Maximum diagnostic output current

-1

10

mA

—

1.4

—10

ESD1

—

4

C=100pF, R=1500

Ω,

ESD2

—

0.5

C=200pF, R=0

Ω, L=10µH

Pd

Maximum power dissipation

(1)

—

1

W

Tj max.

Max. storage & operating junction temp.

-40

+150

Vcc max.

Maximum Vcc voltage

—

50

V

V

A

kV

Recommended Operating Conditions

These values are given for a quick design. For operation outside these conditions, please consult the application notes.

Symbol Parameter

Min.

Max.

Units

Vcc

Continuous Vcc voltage

5.5

35

VIH

High level input voltage

4

5.5

VIL

Low level input voltage

-0.3

0.9

Iout

Continuous output current

Tc=85

—

1.6

A

Rin

Recommended resistor in series with IN pin

4

6

Rdg

Recommended resistor in series with DG pin

10

20

V

k

Ω