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B320 Datasheet(PDF) 1 Page - GUANGDONG HOTTECH INDUSTRIAL CO.,LTD. |
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B320 Datasheet(HTML) 1 Page - GUANGDONG HOTTECH INDUSTRIAL CO.,LTD. |
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1 / 2 page ![]() Page:P2-P1 Plastic-Encapsulate Diodes GUANGDONG HOTTECH INDUSTRIAL CO., LTD. FEATURES MECHANICAL DATA MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. SCHOTTKY DIODES 10 DO-214AB (SMC) 0.125(3.17) 0.115(2.92) 0.245(6.22) 0.220(5.59) 0.280(7.11) 0.260(6.60) 0.103(2.62) 0.079(2.06) 0.060(1.52) 0.030(0.76) 0.012(0.305) 0.006(0.152) 0.320(8.13) 0.305(7.75) 0.008(0.203) 0.004(0.102) • Guard Ring Die Construction for Transient Protection • Ideally Suited for Automatic Assembly • Low Power Loss, High Efficiency • Surge Overload Rating to 125A Peak • For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application Case: SMC Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminals: Lead Free Plati ng (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 Weight: 0.21 grams (approximate) B320-B360 Characteristic Symbol B320 B330 B340 B350 B360 Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 20 30 40 50 60 V RMS Reverse Voltage VR(RMS) 14 21 28 35 42 V Average Rectified Output Current @ TT =100 C ° IO 3.0 A Non-Repetitive Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load IFSM 125 A Forward Voltage (Note 3) @ IF = 3.0A VFM 0.50 0.70 V Peak Reverse Current @ TA = 25°C at Rated DC Blocking Voltage (Note 3) @ TA = 100°C IRM 0.5 20 mA Typical Capacitance (Note 2) CT 200 pF Typical Thermal Resistance, Junction to Terminal RθJT 20 °C/W Typical Thermal Resistance, Junction to Ambient (Note 1) RθJA 90 °C/W Operating Temperature Range Tj -55 to +125 °C Storage Temperature Range TSTG -55 to +150 °C Notes: 1. Thermal Resistance: Junction to terminal, unit mounted on glass epoxy substrate with 2x3mm copper pad 2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC. 3. Short duration test pulse used to minimize self-heating effect. 4. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7. |
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