TLV2302, TLV2304

FAMILY OF NANOPOWER OPERATIONAL AMPLIFIERS

AND OPEN DRAIN COMPARATORS

SLOS343 – DECEMBER 2000

15

POST OFFICE BOX 655303

APPLICATION INFORMATION

general power dissipation considerations

For a given

P

D +

T

MAX

–T

A

q

JA

Where:

= Maximum power dissipation of TLV230x IC (watts)

= Free-ambient air temperature (

°C)

1

0.75

0.5

0

–55 –40 –25 –10 5

1.25

1.5

MAXIMUM POWER DISSIPATION

vs

FREE-AIR TEMPERATURE

1.75

20 35 50

0.25

TA – Free-Air Temperature – °C

2

65 80 95 110 125

MSOP Package

Low-K Test PCB

θJA = 260°C/W

TJ = 150°C

PDIP Package

Low-K Test PCB

θJA = 104°C/W

SOIC Package

Low-K Test PCB

θJA = 176°C/W

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 37. Maximum Power Dissipation vs Free-Air Temperature