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BGS12PL6 Datasheet(PDF) 13 Page - Infineon Technologies AG |
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BGS12PL6 Datasheet(HTML) 13 Page - Infineon Technologies AG |
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13 / 15 page ![]() BGS12PL6 0.05 MAX. ±0.05 0.7 ±0.035 0.2 1) 0.4 1) Dimension applies to plated terminals 5 2 6 4 1 3 Top view Bottom view Pin 1 marking TSLP-6-4-PO V01 (0.05) (0.05) +0.01 0.31 -0.02 Figure 3: Package Outline 0.25 0.4 0.25 0.4 TSLP-6-4-FP V01 Stencil apertures Copper Solder mask (stencil thickness 100 µm) NSMD Figure 4: Footprint Figure 5: Pin 1 Marking (top view) Data Sheet 13 Revision 2.4 - 2014-05-27 |
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