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NCP435 Datasheet(PDF) 8 Page - ON Semiconductor

Part # NCP435
Description  2A Ultra-Small Controlled Load Switch
PDF  10 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP435 Datasheet(HTML) 8 Page - ON Semiconductor

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NCP434, NCP435
www.onsemi.com
8
FUNCTIONAL DESCRIPTION
Overview
The NCP434 − NCP435 are high side P channel MOSFET
power distribution switch designed to isolate ICs connected
on the battery in order to save energy. The part can be turned
on, with a range of battery from 1.0 V to 4 V.
Enable Input
Enable pin is an active high. The path is opened when EN
pin is tied low (disable), forcing P MOS switch off.
The IN/OUT path is activated with a minimum of VIN of
1.0 V and EN forced to high level.
Auto Discharge (NCP435 Only)
NMOS FET is placed between the output pin and GND,
in order to discharge the application capacitor connected on
OUT pin.
The auto−discharge is activated when EN pin is set to low
level (disable state).
The discharge path ( Pull down NMOS) stays activated as
long as EN pin is set at low level and VIN > 1.0 V.
In order to limit the current across the internal discharge
NMOSFET, the typical value is set at 65
W.
CIN and COUT Capacitors
IN and OUT, 1
mF, at least, capacitors must be placed as
close as possible the part for stability improvement.
APPLICATION INFORMATION
Power Dissipation
Main contributor in term of junction temperature is the
power dissipation of the power MOSFET. Assuming this,
the power dissipation and the junction temperature in
normal mode can be calculated with the following
equations:
P
D + RDS(on)
I
OUT
2
PD
= Power dissipation (W)
RDS(on)
= Power MOSFET on resistance (
W)
IOUT
= Output current (A)
T
J + RD
RqJA ) TA
TJ
= Junction temperature (
°C)
RqJA
= Package thermal resistance (
°C/W)
TA
= Ambient temperature (
°C)
PCB Recommendations
The NCP434 − NCP435 integrate an up to 2 A rated
PMOS FET, and the PCB design rules must be respected to
properly evacuate the heat out of the silicon. By increasing
PCB area, especially around IN and OUT pins, the RqJA of
the package can be decreased, allowing higher power
dissipation.
Figure 15. Routing Example 1 oz, 2 Layers, 100
5C/W



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