2003 Jun 23

6

Philips Semiconductors

Product specification

High-speed diode

BAS16L

PACKAGE OUTLINE

UNIT

max.

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.50

0.46

0.55

0.47

0.03

0.62

0.55

0.65

DIMENSIONS (mm are the original dimensions)

Notes

1. Including plating thickness

2. The marking bar indicates the cathode

0.30

0.22

SOD882

03-04-16

03-04-17

DE

1.02

0.95

L

E

(2)

2

1

b

A1

A

D

L

Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm

SOD882

0

0.5

1 mm

scale

e1