DS1747/DS1747P Y2K-Compliant, Nonvolatile Timekeeping RAMs

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PACKAGE INFORMATION (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package

outline information, go to www.maxim-ic.com/DallasPackInfo.)

34-PIN PowerCap

MODULE

PKG

DIM

MIN

NOM

MAX

A

IN

0.920

0.925

0.930

B

IN

0.980

0.985

0.990

C

IN

—

—

0.080

D

IN

0.052

0.055

0.058

E

IN

0.048

0.050

0.052

F

IN

0.015

0.020

0.025

G

IN

0.025

0.027

0.030

NOTE: DALLAS SEMICONDUCTOR RECOMMENDS THAT POWERCAP MODULE

BASES EXPERIENCE ONE PASS THROUGH SOLDER REFLOW ORIENTED WITH THE

LABEL SIDE UP (“LIVE-BUG”).

NOTE: HAND SOLDERING AND TOUCH-UP: DO NOT TOUCH OR APPLY THE

SOLDERING IRON TO LEADS FOR MORE THAN 3 SECONDS. TO SOLDER, APPLY FLUX

TO THE PAD, HEAT THE LEAD FRAME PAD, AND APPLY SOLDER. TO REMOVE THE

PART, APPLY FLUX, HEAT THE LEAD FRAME PAD UNTIL THE SOLDER REFLOWS, AND

USE A SOLDER WICK TO REMOVE SOLDER.

COMPONENTS AND PLACEMENT MAY VARY FROM EACH DEVICE TYPE.