EMC1001

DS20005411A-page 4

 2015 Microchip Technology Inc.

Setup Time Start

TSU:STA

0.6

—

—

µs

Setup Time Stop

TSU:STO

0.6

—

—

µs

Data Hold Time

THD:DAT

0.3

—

—

µs

Data Setup Time

TSU:DAT

100

—

—

ns

Clock Low Period

1.3

—

—

µs

Clock High Period

0.6

—

—

µs

Clock/Data Fall Time

—

300

ns

Clock/Data Rise Time

—300(1)

ns

Capacitive Load (each bus

line)

Cb

0.6

—

400

pF

TABLE 1-1:

SMBUS ADDRESS CONFIGURATION INFORMATION

Part Number

ADDR/THERM Pull-up Resistor

SMBus Address

Package Description

EMC1001

7.5 k

 ±5%

(Note 1, Note 2)

100 1000b

6-Lead TSOT

12 k

 ±5% (Note 2)

100 1001b

6-Lead TSOT

20 k

 ±5% (Note 2)

011 1000b

6-Lead TSOT

33 k

 ±5% (Note 2)

011 1001b

6-Lead TSOT

EMC1001-1

7.5 k

 ±5% (Note 1, Note 2)

100 1010b

6-Lead TSOT

12 k

 ±5% (Note 2)

100 1011b

6-Lead TSOT

20 k

 ±5% (Note 2)

011 1010b

6-Lead TSOT

33 k

 ±5% (Note 2)

011 1011b

6-Lead TSOT

Note 1:

This value must be greater than 1 k

 5% and less than or equal to 7.5 k5%

2:

than 100 pF.

ELECTRICAL SPECIFICATIONS (CONTINUED)

Parameter

Symbol

Min.

Typ.

Max.

Units

Conditions

Note 1:

300 ns rise time maximum is required for 400 kHz bus operation. For lower clock frequencies, the

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Ambient Temperature Range

-25

—

+125

°C

Storage Temperature Range

-55

—

+150

°C

Maximum Junction Temperature

-40

—

+150

°C

Package Thermal Resistances

Thermal Resistance, 6L-TSOT



JA

—112

—

°C/W