CL8800

DS20005357A-page 4

 2015 Microchip Technology Inc.

FIGURE 1-1:

OUTPUT CURRENT THERMAL CHARACTERISTICS

TABLE 1-3:

THERMAL RESISTANCE

Package

33-Lead QFN

24°C/W

2.5°C/W

1

1.0 oz Cu 4-layer board, 3x4” PCB with thermal pad and thermal via array.

2

Junction to exposed heat slug.

250

200

150

100

50

0

-60

-40

-20

0

20

40

60

80

100

120

140

Temperature (°C)

Maximum Output Current

Taps 4&5

Taps 3&6

Tap 2

Tap 1