ADT7481

http://onsemi.com

2

Figure 1. Functional Block Diagram

ON-CHIP

TEMPERATURE

SENSOR

ANALOG

MUX

BUSY

11-BIT A-TO-D

CONVERTER

LOCAL TEMPERATURE

VALUE REGISTER

REMOTE 1 AND 2 TEMP

OFFSET REGISTER

RUN/STANDBY

EXTERNAL DIODE OPEN-CIRCUIT

STATUS REGISTERS

SMBUS INTERFACE

INTERRUPT

MASKING

SDATA

SCLK

10

9

ONE-SHOT

REGISTER

CONVERSION RATE

REGISTER

LOCAL TEMPERATURE

THERM LIMIT REGISTER

LOCAL TEMPERATURE

LOW LIMIT REGISTER

LOCAL TEMPERATURE

HIGH LIMIT REGISTER

REMOTE 1 & 2 TEMP.

THERM LIMIT REG.

REMOTE 1 & 2 TEMP.

LOW LIMIT REGISTERS

REMOTE 1 & 2 TEMP.

HIGH LIMIT REGISTERS

CONFIGURATION

REGISTER

4

8

GND

5

1

ADT7481

D1+

ALERT/THERM2

THERM

2

D1−

3

D2+

7

D2−

6

REMOTE 1 AND 2 TEMP

VALUE REGISTER

ADDRESS POINTER

REGISTER

Table 1. ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

−0.3 to +3.6

V

D+

V

D− to GND

−0.3 to +0.6

V

SCLK, SDATA, ALERT, THERM

−0.3 to +3.6

V

Input Current, SDATA, THERM

−1 to +50

mA

Input Current, D−

±1

mA

ESD Rating, All Pins (Human Body Model)

1,500

V

150

°C

Storage Temperature Range

−65 to +150

°C

IR Reflow Peak Temperature

220

°C

IR Reflow Peak Temperature for Pb-Free

260

°C

Lead Temperature, Soldering (10 sec)

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE:

This device is ESD sensitive. Use standard ESD precautions when handling.

Table 2. THERMAL CHARACTERISTICS

Package Type

Unit

10-lead MSOP

142

43.74

°C/W