SN10501D datasheet(2/23 Pages) TI

2 / 23 page

SN10501

SN10502

SN10503

SLOS408A − MARCH 2003 − REVISED DECEMBER 2003

www.ti.com

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNIT

Supply voltage, VS

18 V

Input voltage, VI

±VS

Output current, IO (2)

150 mA

Differential input voltage, VID

4 V

Continuous power dissipation

See Dissipation Rating Table

Maximum junction temperature, TJ(3)

150

°C

Maximum junction temperature, continuous

operation, longterm reliability, TJ(4)

125

°C

Operating free-air temperature range, TA

−40

°C to 85°C

Storage temperature range, Tstg

−65

°C to 150°C

Lead temperature

1,6 mm (1/16 inch) from case for 10 seconds

300

°C

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

(2) The SN1050x may incorporate a PowerPAD on the underside of

the chip. This acts as a heatsink and must be connected to a

thermally dissipative plane for proper power dissipation. Failure

to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI

technical brief SLMA002 and SLMA004 for more information

about utilizing the PowerPAD thermally enhanced package.

(3) The absolute maximum temperature under any condition is

limited by the constraints of the silicon process.

(4) The maximum junction temperature for continuous operation is

limited

package

constraints.

Operation

above

this

temperature may result in reduced reliability and/or lifetime of the

device

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PACKAGE DISSIPATION RATINGS

PACKAGE

ΘJC

ΘJA(1)

POWER RATING(2)

PACKAGE

ΘJC

(

°C/W)

ΘJA(1)

(

°C/W)

TA ≤ 25°C

TA = 85°C

DBV (5)

255.4

391 mW

156 mW

D (8)

38.3

97.5

1.02 W

410 mW

D (14)

26.9

66.6

1.5 W

600 mW

DGK (8)

54.2

260

385 mW

154 mW

DGN (8)

4.7

58.4

1.71 W

685 mW

PWP (14)

2.07

37.5

2.67 W

1.07 W

(1) This data was taken using the JEDEC standard High-K test PCB.

(2) Power rating is determined with a junction temperature of 125°C.

This is the point where distortion starts to substantially increase.

Thermal management of the final PCB should strive to keep the

junction temperature at or below 125

°C for best performance and

long term reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Supply voltage,

Dual supply

±1.35

±9

Supply voltage,

(VS+ and VS−)

Single

supply

2.7

Input common-mode

voltage range

VS− + 1.1 VS+ − 1.1

PACKAGE/ORDERING INFORMATION

TEMPERATURE

PACKAGED DEVICES

PACKAGE TYPE

TRANSPORT

TEMPERATURE

SINGLE

DUAL

TRIPLE

PACKAGE TYPE

TRANSPORT

MEDIA, QUANTITY

SN10501DBVT

−−−

SOT−23−5

Tape and Reel, 250

SN10501DBVR

−−−

SOT−23−5

Tape and Reel, 3000

SN10501DGK

SN10502DGK

−−−

MSOP−8

Rails, 75

SN10501DGKR

SN10502DGKR

−−−

MSOP−8

Tape and Reel, 2500

−40

°C to 85°C

SN10501DGN

SN10502DGN

−−−

MSOP−8−PP

Rails, 75

−40

°C to 85°C

SN10501DGNR

SN10502DGNR

−−−

MSOP−8−PP

Tape and Reel, 2500

SN10501D

SN10502D

SN10503D

SOIC

Rails, 75

SN10501DR

SN10502DR

SN10503DR

SOIC

Tape and Reel, 2500

−−−

SN10503PWP

TSSOP−14−PP

Rails, 75

−−−

SN10503PWPR

TSSOP−14−PP

Tape and Reel, 2000

SN10501D Datasheet(PDF) 2 Page - Texas Instruments

SN10501D Datasheet(HTML) 2 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

Datasheet Download

Link URL