www.ti.com

1

2

3

4

8

7

6

5

NC

NC

NC

D, DGN

TOP VIEW

D, DGN

TOP VIEW

NC = No Internal Connection

1

2

3

4

8

7

6

5

REF

PD

NC

NC = No Internal Connection

THS3110

THS3111

Note: The device with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin

DISSIPATION RATING TABLE

THS3110, THS3111

SLOS422A – SEPTEMBER 2003 – REVISED NOVEMBER 2003

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling procedures and installation procedures can cause damage.

AVAILABLE OPTIONS

PACKAGED DEVICE

PLASTIC SMALL OUTLINE SOIC (D)

SYMBOL

THS3110CD

THS3110CDGN

0

°C to 70°C

BJB

THS3110CDR

THS3110CDGNR

THS3110ID

THS3110IDGN

-40

°C to 85°C

BIR

THS3110IDR

THS3110IDGNR

THS3111CD

THS3111CDGN

0

°C to 70°C

BJA

THS3111CDR

THS3111CDGNR

THS3111ID

THS3111IDGN

-40

°C to 85°C

BIS

THS3111IDR

THS3111IDGNR

(1)

Available in tape and reel. The R suffix standard quantity is 2500 (e.g. THS3110CDGNR).

(2)

The PowerPAD is electrically isolated from all other pins.

POWER RATING

PACKAGE

Θ

Θ

38.3

95

1.05 W

421 mW

4.7

58.4

1.71 W

685 mW

(1)

This data was taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the

Θ

(2)

This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 inch x 3 inch PCB. For further information, refer to

the Application Informationsection of this data sheet.

2