RN42APL datasheet(10/26 Pages) MICROCHIP

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RN42/RN42N

DS50002328A-page 10

 2015 Microchip Technology Inc.

2.7

Soldering Recommendations

The RN42/RN42N wireless module was assembled

using standard lead-free reflow profile IPC/JEDEC J-

STD-020.

The module can be soldered to the host PCB using

standard leaded and lead-free solder reflow profiles.

To avoid damaging the module, the following recom-

mendations are given:

• Microchip Technology Application Note,” AN233

Solder Reflow Recommendation” (DS00233) pro-

vides solder reflow recommendations

• Do not exceed peak temperature (Tp) of 250 C°

• Refer to the Solder Paste data sheet for specific

reflow profile recommendations

• Use no-clean flux solder paste

• Do not wash as moisture can be trapped under

the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow.

2.8

SPI Interface

The SPI Interface is primarily used for factory program-

ming, test, and diagnostics. Although not required, the

SPI interface is useful for restoring a corrupted flash

image or enabling test modes required for certification

testing.

When module is installed in a final product that requires

European type approval, see Section 3.3 “Europe”, it

is recommended that the SPI interface should be

accessible via 6-pin header as shown in Figure 2-6.

FIGURE 2-6:

OPTIONAL SPI

INTERFACE

2.9

Bluetooth SIG QDID

The RN42 has a QDID registered with the Bluetooth

SIG. The manufacturer using the RN42 module in their

end product can reference this QDID when filing an

EPL (end product listing) to use Bluetooth® brand and

logo. For more information, please visit the Bluetooth

SIG at www.bluetooth.org.

QDID: B014867

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