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BA4560FVT Datasheet(PDF) 37 Page - Rohm |
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BA4560FVT Datasheet(HTML) 37 Page - Rohm |
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37 / 52 page  Datasheet www.rohm.com TSZ02201-0RAR1G200020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 37/48 19.Nov.2014 Rev.003 TSZ22111･15･00 BA4560xxx BA4560Rxxx BA4564RFV BA4564WFV Power Dissipation Power dissipation(total loss) indicates the power that can be consumed by IC at TA =25℃(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θJA℃/W. The temperature of IC inside the package can be estimated by this thermal resistance. Figure 94.(a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient temperature TA, junction temperature TJMAX, and power dissipation PD can be calculated by the equation below: θJA = (TJMAX - TA) / PD ℃ /W Derating curve in Figure 94. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 95.(c), to , (e) show a derating curve for an example of BA4560xxx, BA4560Rxxx, BA4564RFV, BA4564WFV. (Note 17) (Note 18) (Note 19) (Note 20) (Note 21) Unit 5.5 5.4 5.0 4.7 7.0 mW/℃ When using the unit above TA=25℃, subtract the value above per degree℃. Permissible dissipation is the value. Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted. Figure 95. Derating Curve Figure 94. Thermal Resistance and Derating Curve θJA=(TJmax-TA)/ PD °C/W Ambient Temperature TA [ °C ] Chip Surface Temperature TJ [ °C ] (a) Thermal Resistance (b) Derating Curve Ambient Temperature TA [ °C ] Power Dissipation of LSI [W] PD(max) θJA2 < θJA1 θ’JA1 θJA1 TJ’max 0 50 75 100 125 150 25 P1 P2 TJmax θ’JA2 θ JA2 0 0.2 0.4 0.6 0.8 1 0 25 50 75 100 125 AMBIENT TEMPERTURE [℃] . 0 0.2 0.4 0.6 0.8 1 0 25 50 75 100 125 AMBIENT TEMPERATURE TA [℃] . 0 0.2 0.4 0.6 0.8 1 0 25 50 75 100 125 AMBIENT TEMPERTURE [℃] . BA4564RFV/WFV(Note 21) (c)BA4560xxx (d)BA4560Rxxx (e)BA4564RFV/BA4564WFV AMBIENT TEMPERATURE TA[℃] AMBIENT TEMPERATURE TA [℃] BA4560F(Note 17) BA4560FV/FVT(Note 19) BA4560FVM(Note 20) BA4560FJ(Note 18) BA4560F(Note 17) BA4560FV/FVT(Note 19) BA4560FVM(Note 20) BA4560FJ(Note 18) |
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