cui.com

date 07/26/2016

│ page 3 of 9

CUI Inc

│ SERIES: PCN1-M │ DESCRIPTION: DC-DC CONVERTER

SOLDERABILITY

parameter

conditions/description

min

typ

max

units

reflow soldering

see reflow solder profile

245

°C

0

50

100

150

200

250

300

050100

150200

250300

Reflow Time (Seconds)

Notes:

1. Soldering paste: SHENMAO PF610-P (Sn/Ag/Cu)

2. Ramp up rate during preheat: 1.79°C/second (from 30°C~155°C)

3. Soaking temperature: 0.33°C/second (from 155°C~185°C)

4. Ramp up rate during reflow: 0.71°C/second (from 220°C~245°C)

5. Peak temperature: 245°C (10 seconds max), above 220°C 40 to 70 seconds

6. Ramp up rate during cooling: -1.75°C/second (from 220°C~150)

MECHANICAL

parameter

conditions/description

min

typ

max

units

dimensions

single output models: 0.54 x 0.36 x 0.29 [13.7 x 9.2 x 7.4 mm]

dual output models: 0.64 x 0.36 x 0.29 [16.2 x 9.2 x 7.4 mm]

inches

inches

case material

non-conductive black plastic

weight

single output models

dual output models

1.4

1.5

g

g

MECHANICAL DRAWING

PIN CONNECTIONS

PIN

Function

Single

1

-Vin

2

+Vin

3

No pin

4

-Vout

5

+Vout

6

No pin

7

No pin

8

NC

1

2 3 4

8

7 6 5

0.12(3.0) 0.300(7.62)

5-0.024(0.60)

0.100(2.54)

0.54(13.7)

0.39(9.8)

0.44(11.2)

0.100 [2.54]

0.300 [7.62]

0.050 [1.27]

Recommended PCB Layout

Top View

NC=no connection

Single output models

units: inches [mm]

tolerance: X.XX ±0.01 [±0.25]

X.XXX ±0.005 [±0.13]

pin section tolerance: ±0.002[±0.05]

For more information, please visit the product page.