SN65472-EP

www.ti.com

SLRS061 – SEPTEMBER 2013

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

7

V

Input voltage

5.5

V

5.5

V

Off-state output voltage

70

V

400

mA

(4)

500

mA

Absolute maximum junction temperature range

–40

150

°C

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Voltage values are with respect to the network GND, unless otherwise specified.

(3)

This is the voltage between two emitters, A and B.

(4)

Both halves of these dual circuits may conduct rated current simultaneously; however, power dissipation averaged over a short time

interval must fall within the continuous dissipation rating.

THERMAL INFORMATION

SN65472-EP

D

UNITS

8 PINS

115.3

59.7

56.2

°C/W

13.5

55.6

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-board characterization parameter,

from the simulation data for obtaining

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Spacer

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Supply voltage

4.75

5

5.25

V

High-level input voltage

2.1

V

Low-level input voltage

0.8

V

Operating free-air temperature range

-40

85

°C

Operating virtual junction temperature

-40

125

°C

Copyright © 2013, Texas Instruments Incorporated

Submit Documentation Feedback

3

Product Folder Links: SN65472-EP