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FT51A Advanced MCU with 8051 Compatible Core IC Datasheet

Version 1.5

Doc ument N o.: FT _000877

C learance N o.: FT DI#420

7.5 Solder Reflow Profile

The FT51A is supplied in a Pb free package. The recommended solder reflow profile is shown in Figure

7-9 FT51A Solder Reflow Profile.

Figure 7-9 FT51A Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Error! Reference source not

found.. Values are shown for both a completely Pb free solder process (i.e. the FT51A is used with Pb

free solder), and for a non-Pb free solder process (i.e. the FT51A is used with non-Pb free solder).

Profile Feature

Pb Free Solder Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature

TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak Temperature

(tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 7-1 – Reflow Profile Parameters

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

FT51BQ-R Datasheet(PDF) 34 Page - Future Technology Devices International Ltd.

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