CAT24C32

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15

PACKAGE DIMENSIONS

WLCSP5, 1.34x0.91

CASE 567JQ

ISSUE A

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO THE SPHERICAL

CROWNS OF THE SOLDER BALLS.

4. DIMENSION b IS MEASURED AT THE MAXIMUM

BALL DIAMETER PARALLEL TO DATUM C.

2X

DIM

A

MIN

MAX

−−−

MILLIMETERS

A1

D

1.34 BSC

E

b

0.16

0.20

e

0.40 BSC

0.35

E

D

A B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.05 C

5X

b

13

C

B

A

0.10 C

A

A1

A2

C

0.08

0.12

0.91 BSC

e1

0.693 BSC

0.18

5X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.69

0.10 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e1

A2

0.23 REF

RECOMMENDED

A1

PACKAGE

OUTLINE

PITCH

0.40

PITCH

2

DETAIL A

DIE COAT

A3

(OPTIONAL)

DETAIL A

A2

A3

0.025 REF