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IPD65R660CFDA Datasheet(PDF) 5 Page - Infineon Technologies AG |
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IPD65R660CFDA Datasheet(HTML) 5 Page - Infineon Technologies AG |
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5 / 14 page ![]() 5 650VCoolMOS™CFDAPowerTransistor IPD65R660CFDA Rev.2.1,2014-11-19 Final Data Sheet 3Thermalcharacteristics Table3ThermalcharacteristicsDPAK Values Min. Typ. Max. Parameter Symbol Unit Note/TestCondition Thermal resistance, junction - case RthJC 2 K/W Thermal resistance, junction - ambient 1) RthJA 62 K/W SMD version, device on PCB, minimal footprint 35 SMD version, device on PCB, 6cm² cooling area Soldering temperature, wave- & reflowsoldering allowed Tsold 260 °C reflow MSL 1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm² copper area (thickness 70µm) for drain connection. PCB is vertical without air stream cooling. |
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