1998 Mar 26

10

Philips Semiconductors

Product specification

Silicon temperature sensors

KTY82-2 series

PACKAGING

Tape specification

Sensors in SOT23 encapsulation are delivered in reel packaging for automatic placement on hybrid circuits and

printed-circuit boards. The devices are placed with the mounting side downwards in the compartments.

Fig.7 Configuration of bandolier.

Dimension in mm.

(1) Tolerance over any 10 pitches:

±0.2 mm.

handbook, full pagewidth

MBB570 - 2

,,

,,

,,

,,

,,

,,

,,

,

,

,

,

,

1.75

0.1

0.75

min

3.5

0.05

5.5

0.25

8

0.2

0.2

component

1.5

0.1

0

4.0

0.1

2.0

0.1

4.0

direction of unreeling

0.4

max

3.3

max

1.0

min

1.5

max