MAX14783E datasheet(2/18 Pages) MAXIM

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(Voltages referenced to GND.)

VCC .....................................................................-0.3V to +6.0V

RO ............................................................ -0.3V to (VCC + 0.3V)

RE, DE, DI............................................................-0.3V to +6.0V

A, B (VCC ≥ 3.6V) .............................................-8.0V to +13.0V

A, B (VCC < 3.6V) .............................................-9.0V to +13.0V

Short-Circuit Duration (RO, A, B) to GND.................Continuous

Operating Temperature Range

MAX14783EE_ ............................................... -40°C to +85°C

MAX14783EA_ ............................................. -40°C to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Continuous Power Dissipation (TA = +70°C)

µMAX (derate at 4.8mW/°C above +70°C) .................387mW

SO (derate at 7.6mW/°C above +70°C) ......................606mW

TDFN-EP (derate at 24.4mW/°C above +70°C)........1951mW

Lead Temperature (soldering, 10s) ................................. +300ºC

Soldering Temperature (reflow)...................................... +260°C

Junction-to-Case Thermal Resistance (θJC)

8-pin µMAX..................................................................42°C/W

8-pin SO ......................................................................38°C/W

8-pin TDFN-EP ..............................................................8°C/W

Junction-to-Ambient Thermal Resistance (θJA)

8-pin µMAX................................................................206°C/W

8-pin SO ....................................................................132°C/W

8-pin TDFN-EP ............................................................41°C/W

(Note 1)

(VCC = +3.0V to +5.5V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at VCC = +5V and TA = +25°C.) (Notes 2, 3)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

Supply Voltage

VCC

3.0

5.5

Supply Current

ICC

DE = VCC, RE = GND, no load

1.9

Shutdown Supply Current

ISHDN

DE = GND, RE = VCC

µA

DRIVER

Differential Driver Output

VOD

VCC = 4.5V, RL = 54Ω, Figure 1

2.1

VCC = 3V, RL = 100Ω, Figure 1

2.0

VCC = 3V, RL = 54Ω, Figure 1

1.5

Change in Magnitude of Differential

Output Voltage

ΔVOD

RL = 54Ω or 100Ω, Figure 1 (Note 4)

-0.2

+0.2

Driver Common-Mode Output

Voltage

VOC

RL = 54Ω or 100Ω, Figure 1

VCC / 2

Change in Magnitude of Common-

Mode Voltage

ΔVOC

RL = 54Ω or 100Ω, Figure 1 (Note 4)

-0.2

+0.2

Single-Ended Driver Output High

VOH

A or B output, IA or B = -20mA

2.2

Single-Ended Driver Output Low

VOL

A or B output, IA or B = 20mA

0.8

Differential Output Capacitance

COD

DE = RE = VCC, f = 4MHz

Driver Short-Circuit Output Current

|IOST|

0 ≤ VOUT ≤ +12V, output low

250

-7V ≤ VOUT ≤ VCC, output high

250

MAX14783E

High-Speed 3.3V/5V RS-485/RS-422 Transceiver

with ±35kV HBM ESD Protection

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

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