TMS320F2812 datasheet(21/162 Pages) TI

21 / 162 page

Introduction

April 2001 − Revised December 2004

SPRS174L

Table 2−2. Signal Descriptions† (Continued)

NAME

DESCRIPTION

PU/PD§

I/O/Z‡

PIN NO.

NAME

DESCRIPTION

PU/PD§

I/O/Z‡

128-PIN

PBK

176-PIN

PGF

179-PIN

GHH

XINTF SIGNALS (2812 ONLY) (CONTINUED)

XREADY

161

−

Ready Signal. Indicates peripheral is ready to complete the

access when asserted to 1. XREADY can be configured to be

a synchronous or an asynchronous input. See the timing

diagrams for more details.

JTAG AND MISCELLANEOUS SIGNALS

X1/XCLKIN

Oscillator Input − input to the internal oscillator. This pin is also

used to feed an external clock. The 28x can be operated with

an external clock source, provided that the proper voltage

levels be driven on the X1/XCLKIN pin. It should be noted that

the X1/XCLKIN pin is referenced to the 1.8-V (or 1.9-V) core

digital power supply (VDD), rather than the 3.3-V I/O supply

(VDDIO). A clamping diode may be used to clamp a buffered

clock signal to ensure that the logic-high level does not

exceed VDD (1.8 V or 1.9 V) or a 1.8-V oscillator may be used.

Oscillator Output

XCLKOUT

F11

119

−

Output clock derived from SYSCLKOUT to be used for

external wait-state generation and as a general-purpose clock

source. XCLKOUT is either the same frequency, 1/2 the

frequency, or 1/4 the frequency of SYSCLKOUT. At reset,

XCLKOUT = SYSCLKOUT/4. The XCLKOUT signal can be

turned off by setting bit 3 (CLKOFF) of the XINTCNF2 register

to 1. Unlike other GPIO pins, the XCLKOUT pin is not placed

in a high impedance state during reset.

TESTSEL

A13

134

Test Pin. Reserved for TI. Must be connected to ground.

XRS

160

113

I/O

Device Reset (in) and Watchdog Reset (out).

Device reset. XRS causes the device to terminate execution.

The PC will point to the address contained at the location

0x3FFFC0. When XRS is brought to a high level, execution

begins at the location pointed to by the PC. This pin is driven

low by the DSP when a watchdog reset occurs. During

watchdog reset, the XRS pin will be driven low for the

watchdog reset duration of 512 XCLKIN cycles.

The output buffer of this pin is an open-drain with an internal

pullup (100

µA, typical). It is recommended that this pin be

driven by an open-drain device.

TEST1

I/O

−

Test Pin. Reserved for TI. On F281x devices, TEST1 must be

left unconnected. On C281x devices, this pin is a “no connect

(NC)” (i.e., this pin is not connected to any circuitry internal

to the device).

TEST2

I/O

−

Test Pin. Reserved for TI. On F281x devices, TEST2 must be

left unconnected. On C281x devices, this pin is a “no connect

(NC)” (i.e., this pin is not connected to any circuitry internal

to the device).

† Typical drive strength of the output buffer for all pins is 4 mA except for TDO, XCLKOUT, XF, XINTF, EMU0, and EMU1 pins, which are 8 mA.

‡ I = Input, O = Output, Z = High impedance

§ PU = pin has internal pullup; PD = pin has internal pulldown. Pullup/pulldown strength is given in Section 6.3.

TMS320F2812 Datasheet(PDF) 21 Page - Texas Instruments

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