June 2015

DocID027918 Rev 2

1/5

For further information contact your local STMicroelectronics sales

office

www.st.com

STWLC03

Dual mode Qi/PMA wireless power receiver

Data brief

Features



Up to 7.5 W output power



Qi and/or PMA standard communication

protocol



Integrated high efficiency synchronous

rectifier



1 MHz programmable buck converter with

input current and input voltage regulation

loop



Buck converter efficiency up to 92%



Simplified Li-Ion/Polymer charger function



32-bit, 16 MHz embedded microcontroller

with 16 Kbyte ROM and 2 Kbyte RAM

memory



2 Kbyte NVM memory for customization



10-bit, 8 channel A/D converter



Integrated driver for external supply voltage

switch



Four configurable GPIOs



Integrated 5 V LDO for auxiliary features



Precise voltage and current measurements

for FOD function



Transmitter presence detection



Integrated driver for external resonant switch



I



Rx coil NTC protection



Thermal protection



Flip Chip 77 bumps (3.12x4.73 mm)

Applications



Cellular phones



PDAs



Navigation systems



Medical and healthcare instrumentation

Description

The STWLC03 is a high-end WPC and PMA

compliant wireless power receiver IC. It includes

a wireless power receiver, a programmable buck

converter with simplified basic Li-Polymer/Li-Ion

battery charger function and the embedded

microcontroller, which allows a very wide range of

customization and different standard supports.

The integrated NVM memory stores the

customized parameters via JTAG or I

of the device. Thanks to the integrated

synchronous rectifier, it achieves high efficiency

operations. The buck converter contains the

configurable soft-start, input current and input

voltage regulation loops to optimize the function

in a wireless charging enviroment. If the wireless

power is not available, the device can be

supplied from an external supply and can

through an external switch. The embedded

microcontroller communicates with the host

platform through the I

blocks for the frequency detection and the driver

for the external switch for the resonant frequency

change. The package is a CSP suitable for very

compact applications and it has a quad SPI

interface with the external Flash memory for

firmware development purposes.

Table 1: Device summary

Order code

Package

Packing

STWLC03JR

Flip Chip 77

bumps

(3.12x4.73 mm)

Tape and reel