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STWLC04JR Datasheet(PDF) 15 Page - STMicroelectronics |
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STWLC04JR Datasheet(HTML) 15 Page - STMicroelectronics |
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15 / 18 page ![]() STWLC04 Package information DocID029626 Rev 2 15/18 5 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 5.1 Flip Chip 77 bumps (3.12x4.73 mm) package information Figure 12: Flip Chip 77 bumps (3.12x4.73 mm) package outline |
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