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158

TL Series

Modular Heat Sinkable

Thick Film Power

Thermal Resistance

Ultra*

Std**

Nominal Surge Load

Max. Voltage

Ohm

Ultra

Std.

Series

Wattage Wattage

Power

(10 sec.) between terminals

Range

(10% tol.) (3%-5% tol.)

TL54

35

27

18

72

1000

0.3Ω - 1MΩ

1.26

1.67

TL71

96

71

48

192

2000

1.0Ω - 2MΩ

0.53

0.70

TL88

155

114

78

312

2500

1.5Ω - 3MΩ

0.34

0.45

TL104

215

158

108

432

2500

2.0Ω - 4MΩ

0.25

0.33

†TL122

275

202

137

548

2500

2.0Ω - 4MΩ

* For properly heat sinked, untrimmed resistors - see chart

** For properly heat sinked, trimmed resistors - see chart

† Power Ratings are theoretical. Consult Factory for details.

Operating voltage 1200 VAC

Dielectric Withstanding Voltage 2500 VAC

Resistive Element Thick Film on Alumina

Housing Aluminum

Insulators Glass reinforced high temperature Valox®

Terminals Tinned brass

Power Range 27 – 275 watts

Resistance Range 0.3Ω – 4MΩ

Tolerance Ultra Power (U Style): ±10% std.

Standard Power: ±10% std.; 5% and 1% available

Temperature Coefficient ±250 PPM

Test Voltage for 1 Minute 6000 VDC/2500 VAC

Working Voltage 1200 VAC

External Creeping Distance 12mm

Temperature Limits -40°C to +125°C

Insulation >1002 MΩ/500V

Air Distance, Terminal to Ground 7mm

Inductance 50-100 nH

THIS PRODUCT IS

DESIGNED FOR USE WITH

PROPER HEATSINKING.

Maximum base plate temperature of the

resistor must be monitored and kept

within specified limits to establish the

power rating. Best technique is to attach

a thermocouple to the side of the base

plate of the resistor. Temperature of plastic

housing or heat sink cannot be used to

establish rating of the resistor.

The TL Series add heat sinkable options to the

thick film resistor family. The resistor element

is packaged with plastic insulators, and quick-

connect terminals in a symmetrical aluminum

profile for easy heat sink mounting. Special

tapped configurations are offered to reduce on

board component count.

Efficient thermal packaging provides improved

heat conduction to the heat sink. Self-insulating

package design increases voltage withstanding

characteristics when compared to traditional

aluminum housings. The in line mounting profile

makes the TL Series easily adaptable to most

heat sink systems. Thermal compound is always

recommended when heat sinking.

Fea T ure S

• Very low inductance

• Low profile design

• In-Line Mounting

Profile

minals

• Consult factory for

common, isolated, or

special multiple tap

options.

S er I e S SP e CIFIC aTIONS

aPPLIC a TIONS

• Semiconductor Balancing

• Frequency Converters

• Snubber

• In-Rush Current Limiter

• Bleeder Resistor

• Power Switching

• Voltage Dividers

C hara CT er ISTICS

(continued)