LM2991 datasheet(3/11 Pages) NSC

3 / 11 page

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Input Voltage

−26V to +0.3V

ESD Susceptibility (Note 2)

2 kV

Power Dissipation (Note 3)

Internally limited

Junction Temperature (T

Jmax)

125˚C

Storage Temperature Range

−65˚C to +150˚C

Lead Temperature (Soldering, 10 sec.)

230˚C

Operating Ratings (Note 1)

Junction Temperature Range (T

−40˚C to +125˚C

Maximum Input Voltage (Operational)

−26V

Electrical Characteristics

IN = −10V, VO = −3V, IO = 1A, CO = 47 µF, R1 = 2.7k, TJ = 25˚C, unless otherwise specified. Boldface limits apply over

the entire operating junction temperature range.

Parameter

Conditions

Typical

Min

Max

Units

(Note 4)

Reference Voltage

5 mA

≤ I

O ≤ 1A

−1.210

−1.234

−1.186

5mA

≤ I

O ≤ 1A,

−1.27

−1.15

O −1V ≥ VIN ≥ −26V

Output Voltage

−2

−3

Range

IN = −26V

−25

−24

Line Regulation

O = 5 mA, VO −1V ≥ VIN ≥ −26V

0.004

0.04

%/V

Load Regulation

50 mA

≤ I

O ≤ 1A

0.04

0.4

Dropout Voltage

O = 0.1A, ∆VO ≤ 100 mV

0.1

0.2

0.3

O = 1A, ∆VO ≤ 100 mV

0.6

0.8

Quiescent Current

O ≤ 1A

0.7

Dropout Quiescent

IN = VO,IO ≤ 1A

Current

Ripple Rejection

ripple = 1 Vrms, f ripple = 1 kHz,

O = 5mA

Output Noise

10 Hz − 100 kHz, I

O = 5 mA

200

450

µV

ON /OFF Input

OUT: ON)

1.2

0.8

Voltage

OUT: OFF)

1.3

2.4

ON /OFF Input

ON/OFF = 0.8V (VOUT: ON)

0.1

µA

Current

ON/OFF = 2.4V (VOUT: OFF)

100

Output Leakage

IN = −26V, VON/OFF = 2.4V

250

µA

Current

OUT = 0V

Current Limit

OUT = 0V

1.5

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the deivce is in-

tended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: Human body model, 100 pF discharged through a 1.5 k

Ω resistor.

Note 3: The maximum power dissipation is a function of TJmax, θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax

−TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 125˚C and the LM2991 will go into thermal shutdown. For the LM2991, the

junction-to-ambient thermal resistance is 53˚C/W for the TO-220, 73˚C/W for the TO-263, and junction-to-case thermal resistance is 3˚C. If the TO-263 package is

used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package. Using 0.5 square inches of copper area,

θJA is 50˚C/W; with 1 square inch of copper area, θJA is 37˚C/W; and with 1.6 or more square inches of copper area, θJA is 32˚C/W.

Note 4: Typicals are at TJ = 25˚C and represent the most likely parametric norm.

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