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SST39VF401C Datasheet(PDF) 33 Page - Microchip Technology |
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SST39VF401C Datasheet(HTML) 33 Page - Microchip Technology |
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33 / 38 page ![]() ©2014 Silicon Storage Technology, Inc. DS20005053B 04/14 33 4 Mbit (x16) Multi-Purpose Flash Plus SST39VF401C / SST39VF402C / SST39LF401C / SST39LF402C Data Sheet Product Ordering Information SST 39 VF 401C - 70 - 4C - EKE XX XX XXXX - XX - XX - XXX Environmental Attribute E1 = non-Pb Package Modifier K = 48 balls or leads Q = 48 balls (66 possible positions) Package Type E = TSOP (type1, die up, 12mm x 20mm) B3 = TFBGA (6mm x 8mm, 0.8mm pitch) MA = WFBGA (4mm x 6mm, 0.5mm pitch) Temperature Range C = Commercial = 0°C to +70°C I = Industrial = -40°C to +85°C Minimum Endurance 4 = 10,000 cycles Read Access Speed 70 = 70 ns 55 = 55 ns Hardware Block Protection 1 = Bottom Boot-Block 2 = Top Boot-Block Device Density 40 = 4 Mbit Voltage V = 2.7-3.6V L = 3.0-3.6V Product Series 39 = Multi-Purpose Flash 1. Environmental suffix “E” denotes non-Pb solder. non-Pb solder devices are “RoHS Compliant”. |
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