SH8KA2 datasheet(2/14 Pages) ROHM

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SH8KA2

Datasheet

lThermal resistance

Parameter

Symbol

Values

Unit

Min.

Typ.

Max.

Thermal resistance, junction - ambient (total)

RthJA*4

62.5

℃/W

RthJA*5

89.2

lElectrical characteristics (Ta = 25°C) <Tr1 and Tr2>

Parameter

Symbol

Conditions

Values

Unit

Min.

Typ.

Max.

Drain - Source breakdown

voltage

V(BR)DSS VGS = 0V, ID = 1mA

Breakdown voltage

temperature coefficient

ΔV(BR)DSS ID = 1mA

mV/℃

　 ΔTj

　referenced to 25℃

Zero gate voltage

drain current

IDSS

VDS = 30V, VGS = 0V

μA

Gate - Source

leakage current

IGSS

VDS = 0V, VGS = ±20V

±100

Gate threshold

voltage

VGS(th)

VDS = VGS, ID = 1mA

1.0

2.5

Gate threshold voltage

temperature coefficient

ΔV

GS(th)

ID = 1mA

-3

mV/℃

　 ΔTj

　referenced to 25℃

Static drain - source

on - state resistance

RDS(on)*6

VGS = 10V, ID = 8A

mΩ

VGS = 4.5V, ID = 6A

Gate resistance

f = 1MHz, open drain

2.5

Forward Transfer

Admittance

|Yfs|*6

VDS = 5V, ID = 6A

4.2

*1 Pw ≦ 1s, Mounted on a ceramic board (30×30×0.8mm), Limited only by maximum temperature allowed.

*2 Pw ≦ 10μs, Duty cycle ≦ 1%

*3 L ⋍ 0.1mH, VDD = 15V, RG = 25Ω, STARTING Tj = 25℃ Fig.3-1,3-2

*4 Mounted on a ceramic board (30×30×0.8mm)

*5 Mounted on a Cu board (25×25×0.8mm)

*6 Pulsed

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20160203 - Rev.001

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